You may want to deposit a patch of Ti, Cr, Al, Ta, Mo, or Nb to the substrate. Although Cr and Ti are the most commonly used to interface oxide substrates with metals like Au, any (1) layer of the metals that I listed above should work well. A stable bond is the result and you only need 5-10 nm of it deposited under the gold. Hope that helps.
You may want to deposit a patch of Ti, Cr, Al, Ta, Mo, or Nb to the substrate. Although Cr and Ti are the most commonly used to interface oxide substrates with metals like Au, any (1) layer of the metals that I listed above should work well. A stable bond is the result and you only need 5-10 nm of it deposited under the gold. Hope that helps.
Dear Minh Pham,
See relevant information below:
https://physics.stackexchange.com/questions/207985/how-to-make-electrical-connection-to-silicon-wafer-for-testing
https://www.sciencedirect.com/topics/engineering/solder-bump
https://www.researchgate.net/publication/268291977_Evaluation_of_Thin_Film_Indium_Bonding_at_Wafer_Level
www.researchgate.net/publication/258297269_Low-temperature_thin-film_indium_bonding_for_reliable_wafer-level_hermetic_MEMS_packaging
Dear Minh Pham,
See relevant information below:
https://physics.stackexchange.com/questions/207985/how-to-make-electrical-connection-to-silicon-wafer-for-testing
https://www.sciencedirect.com/topics/engineering/solder-bump
https://www.researchgate.net/publication/268291977_Evaluation_of_Thin_Film_Indium_Bonding_at_Wafer_Level
www.researchgate.net/publication/258297269_Low-temperature_thin-film_indium_bonding_for_reliable_wafer-level_hermetic_MEMS_packaging
More
VOTE
You may want to deposit a patch of Ti, Cr, Al, Ta, Mo, or Nb to the substrate. Although Cr and Ti are the most commonly used to interface oxide substrates with metals like Au, any (1) layer of the metals that I listed above should work well. A stable bond is the result and you only need 5-10 nm of it deposited under the gold. Hope that helps.
You may want to deposit a patch of Ti, Cr, Al, Ta, Mo, or Nb to the substrate. Although Cr and Ti are the most commonly used to interface oxide substrates with metals like Au, any (1) layer of the metals that I listed above should work well. A stable bond is the result and you only need 5-10 nm of it deposited under the gold. Hope that helps.
More
VOTE
Dear Minh Pham,
See relevant information below:
https://physics.stackexchange.com/questions/207985/how-to-make-electrical-connection-to-silicon-wafer-for-testing
https://www.sciencedirect.com/topics/engineering/solder-bump
https://www.researchgate.net/publication/268291977_Evaluation_of_Thin_Film_Indium_Bonding_at_Wafer_Level
www.researchgate.net/publication/258297269_Low-temperature_thin-film_indium_bonding_for_reliable_wafer-level_hermetic_MEMS_packaging
Dear Minh Pham,
See relevant information below:
https://physics.stackexchange.com/questions/207985/how-to-make-electrical-connection-to-silicon-wafer-for-testing
https://www.sciencedirect.com/topics/engineering/solder-bump
https://www.researchgate.net/publication/268291977_Evaluation_of_Thin_Film_Indium_Bonding_at_Wafer_Level
www.researchgate.net/publication/258297269_Low-temperature_thin-film_indium_bonding_for_reliable_wafer-level_hermetic_MEMS_packaging
More
VOTE
Instead of soldering use sputtering process using other metal protecting outer surface/opening window..
Instead of soldering use sputtering process using other metal protecting outer surface/opening window..
More
VOTE