Fmoc-3-(4-pyridyl)-D-alanine

White powder

Preparation of des(1)-[D-Tyr2, D-Pya(4)3, AzaGly7, Arg(Me)9, Trp10]MS10 (Compound No. 385) D-Tyr-D-Pya(4)-Asn-Ser-Phe-AzaGly-Leu-Arg(Me)-Trp-NH2 After 100 mg (0.03 mmol) of Fmoc-AzaGly-Leu-Arg(Boc2, Me)-Trp(Boc)-Rink Amide MBHA resin was swollen in DMF, the resin was treated with 2 ml of 20% piperidine/DMF solution for 20 minutes to remove the Fmoc group. After the resin obtained washed with DMF, Phe was introduced by treating the resin with 77.5 g (0.2 mmol) of Fmoc-Phe-OH, 31.8 muL (0.2 mmol) of DIPCDI and 0.4 mL (0.2 mmol) of 0.5M HOAt/DMF solution at room temperature for 90 minutes. In a similar manner, Ser(tBu) and Asn(Trt) were introduced to give Fmoc-Asn(Trt)-Ser(tBu)-Phe-AzaGly-Leu-Arg(Boc2, Me)-Trp(Boc)-Rink Amide MBHA resin. The obtained resin was subjected to Fmoc deprotection and treated with 77.6 mg (0.2 mmol) of [Example 33] (0349) (Synthesis method AG): Production of 3-carboxypropionyl-[D-Hyp24, Iva25, Pya(4)26, Cha27, 36, Leu(Me)28, Lys30, Aib31]-PYY(23-36) (compound No. 350) Compound No. 350: (0350) Synthesis of 3-Carboxypropionyl-[D-Hyp24, Iva25, Pya(4)26, Cha27, 36, Leu(Me)28, Lys30, Aib31]-PYY(23-36) (0351) Using commercially available Sieber Amide resin (391 mg, 0.25 mmol) as a starting material, amino acids were condensed in the order of Cha, Arg(Pbf), Gln(Trt), Arg(Pbf), Thr(But), Aib, Lys(Boc), Asn(Trt), Leu(Me), Cha using ABI433A peptide synthesizer DCC/HOBt 0.25 mmol protocol to give H-Cha-Leu(Me)-Asn(Trt)-Lys(Boc)-Aib-Thr(But)-Arg(Pbf)-Gln(Trt)-Arg(Pbf)-Cha-Sieber Amide resin (SEQ ID NO:186). In this case, the protocol was partly modified, and capping protocol with acetic anhydride was incorporated after every condensation procedure. In addition, the 30-position Lys(Boc) condensation was performed by double coupling. The obtained resin was washed with MeOH and dried to give a resin (972.8 mg, 0.264 mmol/g). (0352) The total amount of the obtained resin was placed in a reaction vessel, washed with DMF, and stirred in DMF for 20 min to swell the resin.

Molecular Weight:388.4
XLogP3:3.6
Hydrogen Bond Donor Count:2
Hydrogen Bond Acceptor Count:5
Rotatable Bond Count:7
Exact Mass:388.14230712
Monoisotopic Mass:388.14230712
Topological Polar Surface Area:88.5
Heavy Atom Count:29
Complexity:555
Defined Atom Stereocenter Count:1
Covalently-Bonded Unit Count:1
Compound Is Canonicalized:Yes