1,3-Isobenzofurandione, 5,5′-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine
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1,3-Isobenzofurandione, 5,5′-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine
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CAS No:
62929-02-6
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Formula:
(C18H22N2.C17H6O7)x
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Chemical Name:
1,3-Isobenzofurandione, 5,5′-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine
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Synonyms:
1,3-Isobenzofurandione,5,5′-carbonylbis-,polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine;1H-Inden-5-amine,1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-,polymer with 5,5′-carbonylbis[1,3-isobenzofurandione];5(6)-Amino-1-(4-aminophenyl)-1,3,3-trimethylindan-benzophenonetetracarboxylic dianhydride copolymer;XU 218;Probimide 293;Probimide 287;XU 293;Araldite XU 218;Probimide 286;Probromide 286;3,3′,4,4′-Benzophenone tetracarboxylic acid dianhydride-5(6)-amino-1-(4′-aminophenyl)-1,3,3-trimethylindane copolymer;106442-40-4;137178-42-8;80497-95-6;206770-41-4
- Categories:
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CAS No:
1,3-Isobenzofurandione, 5,5′-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine Basic Attributes
588.60602
588.19000
Characteristics
156
6.53950
Yellow Powder
1.2
>300°C
638.8ºC at 760 mmHg
>93°(199°F)
Insoluble in water.
1,3-Isobenzofurandione, 5,5′-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine Use and Manufacturing
Polyimides (PI, also known by alternative brand names: Pyralin Apical, Kapton, and Kaptrex) are polymers made of imide monomers (two carbonyl groups bonded to nitrogen). It has a density of 1430 kg/m3, Young’s modulus 3200 MPa, tensile strength (75–90) MPa, glass transition temperature > 400℃, thermal conductivity of 0.53 W/(m K), and a low relative dielectric constant of 2.9. Polyimides have applications similar to BCBs and also find applications as a low dielectric constant material in high-frequency interconnects (low-k material). The higher thermal conductivity and high glass transition temperature when compared to other types of insulating polymers also makes them a good choice where heat dissipation is important or other applications requiring good thermal management or low parasitic capacitances. Microchannels and high-frequency microdevices embedded in both photosensitive and nonphotosensitive polyimides have been fabricated and reported.
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