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Home > Encyclopedia > BISPHENOL A DIGLYCIDYL ETHER RESIN

BISPHENOL A DIGLYCIDYL ETHER RESIN

BISPHENOL A DIGLYCIDYL ETHER RESIN structure

BISPHENOL A DIGLYCIDYL ETHER RESIN 

structure
  • CAS No:

    25068-38-6

  • Formula:

    C15H16O2

  • Chemical Name:

    BISPHENOL A DIGLYCIDYL ETHER RESIN

  • Synonyms:

    (Chloromethyl)oxirane,4,4’-(1-methylethylidene)bisphenolcopolymer;2,2’-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis[oxirane],homopoly;4,1-phenyleneoxymethylene)]bis[oxirane];4,4’-(1-methylethylidene)bisphenol,-,polymerwith2,2’-[(1-methylethylidene);4,4’-(1-methylethylidene)bis-phenopolymerwith(chloromethyl)oxirane;4,4’-(1-methylthylidene)bisphenol,polymerwith2,2’-[(1-methylethylidene)bis(;XB 3585 ES RESIN;Araldite? 502 epoxy resin

  • Categories:

    Cosmetic Ingredient  >  Film Forming

Description

This is a high molecular polymer formed by the condensation of bisphenol A and epichlorohydrin, and it is in the form of a viscous liquid or solid. Its molecular chain contains a large number of epoxy groups and has good thermosetting properties.


This is a high molecular polymer formed by the condensation of bisphenol A and epichlorohydrin, and it is in the form of a viscous liquid or solid. Its molecular chain contains a large number of epoxy groups and has good thermosetting properties.


Poly(Bisphenol-A-co-epichlorohydrin) (PBE) is an epoxy based resin that is a phenoxy polymer derived from bisphenol A and epichlorohydrin.

BISPHENOL A DIGLYCIDYL ETHER RESIN Basic Attributes

228.28634

852.42400

500-033-5

11096

TSCA listed

DTXSID0050479

Gardner: ≤3

Characteristics

116.07000

9.32250

1.18

64-74 °C

114-118 °C

78ºC

7mg/L at 25℃

0Pa at 19.85℃

room temp

Safety Information

UN 3082 9/PG 3

2

Xi,N,Xn,T

28-37/39-61-36-26-23-45-36/37-53

KC2100000

Xi; N; Xn

P201-P273-P280-P305 + P351 + P338-P310

36/38-43-51/53-42/43-63-62-36/37-20/21/22-45-23/24/25

UN 3082 9/PG 3

|Warning|H315: Causes skin irritation [Warning Skin corrosion/irritation]|P261, P264, P272, P273, P280, P302+P352, P305+P351+P338, P321, P332+P313, P333+P313, P337+P313, P362, P363, P391, and P501|H315 (99.94%): Causes skin irritation [Warning Skin corrosion/irritation]|Aggregated GHS information provided by 3647 companies from 24 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.|H315 (81.4%): Causes skin irritation [Warning Skin corrosion/irritation]|P261, P264, P271, P272, P273, P280, P302+P352, P304+P340, P305+P351+P338, P312, P321, P332+P313, P333+P313, P337+P313, P362, P363, P391, P403+P233, P405, and P501|Aggregated GHS information provided by 365 companies from 9 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.|P261, P264, P272, P280, P302+P352, P305+P351+P338, P321, P332+P313, P333+P313, P337+P313, P362, P363, and P501

Drug Information

UP 5-207

BISPHENOL A DIGLYCIDYL ETHER RESIN Use and Manufacturing

Uses

Bisphenol A epoxy resin, used as a structural adhesive in aerospace and automotive industries. The material serves as a protective coating for metal surfaces due to its corrosion resistance. Electronic components frequently employ it for encapsulation and insulation purposes.


Bisphenol A epoxy resin, used as a structural adhesive in aerospace and automotive industries. The material serves as a protective coating for metal surfaces due to its corrosion resistance. Electronic components frequently employ it for encapsulation and insulation purposes.


Araldite506 epoxy resin has been used as an embedding medium for microscopy.


PBE can be used as a reinforcing polymer on nanotubes and nanoparticles which can be useful in electronics, optical and aerospace based applications. It can also be used in the formation of solid polymeric electrolyte for potential application in electrochemical devices.

Fatty acids, C18-unsatd., dimers, polymers with bisphenol A and epichlorohydrin: ACTIVE|XU - indicates a substance exempt from reporting under the Chemical Data Reporting Rule, (40 CFR 711).

Computed Properties

Molecular Weight:320.8
Hydrogen Bond Donor Count:2
Hydrogen Bond Acceptor Count:3
Rotatable Bond Count:3
Exact Mass:320.1179222
Monoisotopic Mass:320.1179222
Topological Polar Surface Area:53
Heavy Atom Count:22
Complexity:247
Undefined Atom Stereocenter Count:1
Covalently-Bonded Unit Count:2
Compound Is Canonicalized:Yes

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