Bisphenol A epoxy resin
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Bisphenol A epoxy resin
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CAS No:
25068-38-6
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Formula:
(C15H16O2.C3H5ClO)x
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Chemical Name:
Bisphenol A epoxy resin
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Synonyms:
Phenol,4,4′-(1-methylethylidene)bis-,polymer with 2-(chloromethyl)oxirane;Phenol,4,4′-isopropylidenedi-,polymer with 1-chloro-2,3-epoxypropane;Phenol,4,4′-(1-methylethylidene)bis-,polymer with (chloromethyl)oxirane;Propane,1-chloro-2,3-epoxy-,polymer with 4,4′-isopropylidenediphenol;Oxirane,(chloromethyl)-,polymer with 4,4′-(1-methylethylidene)bis[phenol];2,2-Bis(p-hydroxyphenyl)propane-epichlorohydrin condensate;Epon 828;Bisphenol A-epichlorohydrin copolymer;Epichlorohydrin-bisphenol A epoxy resin;Epichlorohydrin-bisphenol A resin;Bisphenol A-epichlorohydrin resin;Epichlorohydrin-bisphenol A copolymer;Bisphenol A-epichlorohydrin epoxy resin;ED 5;Bisphenol A-epichlorohydrin condensate;Epon 836;Bis(p-hydroxyphenyl)dimethylmethane-epichlorohydrin copolymer;Bakelite PKDA;Epi-Rez 510;ERL 2795;Diphenylolpropane-epichlorohydrin copolymer;Phenoxy PKHH;Epichlorohydrin-4,4′-dihydroxydiphenylpropane copolymer;Epoxy 7071;Epon 1004;Araldite 6084;Epikote 828;Araldite 6010;Diphenylolpropane-epichlorohydrin polymer;ED-L;Epikote 1004;Epikote 1007;Epon 1001;Epon 1002;Epon 826;Epotuf 37-139;1-Chloro-2,3-epoxypropane-4,4′-isopropylidenebisphenol polymers;1-Chloro-2,3-epoxypropane-4,4′-isopropylidenediphenol polymer;2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin polymer;4,4′-Dihydroxydiphenylpropane-epichlorohydrin polymer;4,4′-Isopropylidenediphenol-1-chloro-2,3-epoxypropane polymer;1336-88-5;1337-15-1;8000-31-5;9015-99-0;9049-54-1;9050-21-9;9081-91-8;9083-76-5;9084-94-0;9086-62-8;9087-26-7;9087-76-7;11097-80-6;11098-13-8;11098-40-1;11100-23-5;11108-41-1;11120-31-3;11121-19-0;11126-36-6;20232-24-0;35038-60-9;36344-96-4;36347-13-4;36347-14-5;37184-50-2;37184-52-4;37208-29-0;37217-92-8;37230-74-3;37243-66-6;37243-67-7;37251-33-5;37265-21-7;37270-82-9;37291-75-1;37293-07-5;37294-18-1;37305-82-1;37307-45-2;37317-45-6;37325-21-6;37338-63-9;37342-17-9;37345-34-9;37348-56-4
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CAS No:
Description
This is a high molecular polymer formed by the condensation of bisphenol A and epichlorohydrin, and it is in the form of a viscous liquid or solid. Its molecular chain contains a large number of epoxy groups and has good thermosetting properties.
This is a high molecular polymer formed by the condensation of bisphenol A and epichlorohydrin, and it is in the form of a viscous liquid or solid. Its molecular chain contains a large number of epoxy groups and has good thermosetting properties.
Safety Information
UN 3082 9/PG 3
2
R45
53-26-36/37-45
KC2100000
Xi; N; Xn
P201-P273-P280-P305 + P351 + P338-P310
H302-H314-H317-H350-H411
|Warning|H315: Causes skin irritation [Warning Skin corrosion/irritation]|P261, P264, P272, P273, P280, P302+P352, P305+P351+P338, P321, P332+P313, P333+P313, P337+P313, P362, P363, P391, and P501|H315 (99.94%): Causes skin irritation [Warning Skin corrosion/irritation]|Aggregated GHS information provided by 3647 companies from 24 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.|H315 (81.4%): Causes skin irritation [Warning Skin corrosion/irritation]|P261, P264, P271, P272, P273, P280, P302+P352, P304+P340, P305+P351+P338, P312, P321, P332+P313, P333+P313, P337+P313, P362, P363, P391, P403+P233, P405, and P501|Aggregated GHS information provided by 365 companies from 9 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.|P261, P264, P272, P280, P302+P352, P305+P351+P338, P321, P332+P313, P333+P313, P337+P313, P362, P363, and P501
Bisphenol A epoxy resin Use and Manufacturing
Bisphenol A epoxy resin, used as a structural adhesive in aerospace and automotive industries. The material serves as a protective coating for metal surfaces due to its corrosion resistance. Electronic components frequently employ it for encapsulation and insulation purposes.
Bisphenol A epoxy resin, used as a structural adhesive in aerospace and automotive industries. The material serves as a protective coating for metal surfaces due to its corrosion resistance. Electronic components frequently employ it for encapsulation and insulation purposes.
Fatty acids, C18-unsatd., dimers, polymers with bisphenol A and epichlorohydrin: ACTIVE|XU - indicates a substance exempt from reporting under the Chemical Data Reporting Rule, (40 CFR 711).
Computed Properties
Molecular Weight:320.8
Hydrogen Bond Donor Count:2
Hydrogen Bond Acceptor Count:3
Rotatable Bond Count:3
Exact Mass:320.1179222
Monoisotopic Mass:320.1179222
Topological Polar Surface Area:53
Heavy Atom Count:22
Complexity:247
Undefined Atom Stereocenter Count:1
Covalently-Bonded Unit Count:2
Compound Is Canonicalized:Yes
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