Industry Grade SPS Bis-(Sodium Sulfopropyl)-disulfide Copper Plating Brightener CAS 27206-35-5 Organic Intermediate

Industrial Grade Bis-(Sodium Sulfopropyl)-disulfide, abbreviated as SPS, with standard CAS No.27206-35-5, is a core high-performance organic sulfur intermediate specially developed for acid sulfate copper plating systems, also named disodium 3,3'-dithiobis(propanesulfonate) in international chemical industry standard naming. Our factory adopts integrated synthesis, activated carbon decolorization, low-temperature recrystallization and vacuum drying purification technology to produce two specifications SPS-95 and SPS-98, fully covering general decorative electroplating and high-precision electronic manufacturing industries worldwide.

The finished product is white to pale yellow crystalline fine powder with strong water solubility, which can be quickly dissolved in deionized water to form clear solution without suspended impurities. Its special molecular structure contains disulfide bond and dual sulfonate functional groups, enabling outstanding cathode adsorption performance during copper electroplating reaction. When added into acid copper plating bath, SPS will preferentially adsorb on the protruding active points of copper surface, inhibit excessive rapid growth of copper crystals, refine grain size significantly, and achieve three core effects: high brightness, strong leveling and anti-burning protection under high current density.

In printed circuit board (PCB) manufacturing industry, SPS-98 high purity grade is the indispensable main brightener for HDI circuit boards and IC substrates. It can realize uniform copper deposition inside micro blind holes and trenches, eliminate copper layer void defects, stabilize circuit conductivity and improve signal transmission performance of 5G communication electronic components. For semiconductor chip wafer damascene copper interconnection process, ultra-low heavy metal impurity index of SPS-98 avoids metal ion pollution to chip circuits, meeting strict semiconductor manufacturing raw material standards. In electrolytic copper foil production, SPS can adjust copper crystal growth orientation to produce low roughness, high tensile strength lithium battery copper foil, widely applied in new energy power battery negative electrode base material production.

For decorative electroplating field including bathroom hardware, automotive decorative parts, jewelry and metal crafts, SPS-95 cost-effective grade matches with PEG, amine leveler and chloride ion to get mirror-bright copper coating surface, with good ductility, anti-tarnish and uniform covering capacity on complex irregular workpiece surfaces. Besides electroplating industry, SPS can also be used as metal chelating auxiliary agent and raw material for synthesis of other sulfur-containing fine chemical intermediates.

We implement full-process batch inspection for each lot of SPS products, strictly testing purity, moisture, water insoluble residue and heavy metal content to guarantee stable plating bath performance and reduce customer production failure rate. The product has strong hygroscopicity, so it must be tightly sealed and stored in cool, dry and ventilated warehouse away from humid air, strong oxidants and alkaline chemicals to prevent deliquescence and quality decline. We support small trial sample orders of 1kg for laboratory plating formula debugging, as well as large-volume bulk shipment of 25kg fiber drums with stable monthly production capacity and fast delivery cycle. Complete COA test report, MSDS safety data sheet and international shipping documents are provided for smooth customs clearance of global chemical buyers.