Sissco Launches World’s First Peroxide-Cured FFKM Polymer with Fluorine-Free Surfactant Technology

Sissco has expanded its first-in-market fluorine-free surfactant (NFS) perfluoroelastomer (FFKM) product line with the release of the world’s first peroxide-cured FFKM polymer using proprietary NFS technology. This groundbreaking innovation addresses the industry's demand for high performance, sustainability, and supply chain resilience solutions.

Following its Q1 2025 launch of acrylate-cured FFKM grades designed for semiconductor applications, Sissco's new peroxide-cured FFKM polymer strengthens its NFS product portfolio, offering the first commercialized FFKM material that eliminates the use of any surfactants. The material achieves outstanding sealing performance, meeting the industry's growing focus on sustainability without compromising on functionality.

This peroxide-cured FFKM NFS solution is tailored for cutting-edge semiconductor manufacturing processes, excelling under extreme conditions such as corrosive chemicals, high temperatures exceeding 320°C, and intense plasma environments. Both dry and wet manufacturing processes benefit significantly from its robust performance.

Beyond semiconductors, its exceptional chemical resistance makes it critical for high-end energy, transportation, and industrial applications. Sissco’s Tecnoflon® FFKM NFS series, produced in Spinetta, Italy, represents the culmination of years of research and development. Samples of Tecnoflon® PFR X7000 and X7100 are now available for testing. The acrylate-cured grades, including Tecnoflon® PFR X6055B, X6160B, and X6265B, are already widely used in the semiconductor sector.

With this latest innovation, Sissco is setting a new standard for sustainable and high-performance materials, catering to the most demanding applications across multiple industries.