Henkel launched a series of adhesives technology products

Recently, Henkel launched a series of innovative adhesives technology products, showing all-round bright products and solutions applied to 5G communications, camera modules, new energy vehicles and industrial automation. LOCTITE ABLESTIK ABP 8068 series semi-sintered chip adhesives introduced by Henkel have excellent and stable reliability, good conductivity and thermal conductivity, and can realize mass production. They can be used in power IC and discrete devices to meet higher heat dissipation requirements. Henkel chip-level electromagnetic interference (EMI) shielding solution can not only achieve smaller and thinner electronic product design, but also flexibly meet the needs of single chip, low cost, simple and clean process. LOCTITE ABLESTIK NCA 2286 chip adhesive introduced by Henkel is used for automatic lens alignment. Its dual curing formula can meet the requirements of high imaging assembly of camera module. Henkel has also introduced thermal conductive adhesives to meet the requirements of new energy vehicles for lightweight, high reliability and efficient production; liquid thermal conductive filler BERGQUIST GAP FILLER series products and LOCTITE BERGQUIST BOND PLY TBP 1400 LMS-HD thermal conductive tape innovative products.