Bostik showcases innovative adhesive solutions at PackPlus India

Bostik, adhesives specialist and subsidiary of French chemicals major, Arkema, recently showcased its products and technology for the packaging industry at the PackPlus India 2019, a leading exhibition on packaging, converting and supply chain industries.

A key focus was on its range of laminating applications with solvent and solvent-free products that can be used across the flexible packaging industry. According to a recent report by research from PC Wood Mackenzie, demand for flexible packaging in the Indian market is estimated to grow at nearly 10 per cent a year over the next five years, currently estimated at $5.6-bn in 2017.

“With the growing urbanisation and rising population of middle-class consumers in India, the packaging industry is experiencing exponential growth. There is no better time than now to increase our presence in the industry,” noted Mr. Daniel Thong, Bostik’s Regional Market Manager for Flexible Packaging.

Besides laminating adhesives, solutions showcased at the Bostik booth included cold seal adhesives and reseal adhesives. Reseal adhesives eliminate the need for secondary packaging (such as zippers) while preserving food freshness, improving product performance and operational efficiencies. Cold seal adhesives are uniquely designed to improve product’s performance, operational efficiencies and aesthetics, especially for confectionary (chocolate), bakery, nutrition bars and other special packaging.