Henkel high thermal conductivity gel material won the NPI award

On February 15, Henkel announced that its Bergquist Liqui Form TLF 10000 high thermal conductivity gel material won the NPI award from "Circuits Assembly" magazine at the IPC APEX EXPO 2023 exhibition held in San Diego, California, USA.

According to reports, in the field of electronic applications, especially in the fields of data, 5G communications, electric vehicles and industrial automation, it is usually necessary to use high-power equipment for data processing and management of digital requirements. The application of high-power devices will lead to increased component density and complexity, resulting in higher thermal output power. Therefore, effective thermal management must be carried out under the premise of ensuring production efficiency, so as to ensure the reliable operation of equipment. This highly thermally conductive gel material from Henkel successfully bridges the gap between process and production.

Wayne Eng, Head of Global Market Strategy, Data & Communications at Henkel, said: "This is a significant solution for improving the performance of high-power systems. Compared with the previous generation, its thermal performance is better. The new product formulation Achieving a very challenging balance of performance provides manufacturers with the product performance the market expects, along with the thermal capability and flexible production features required for mass production."