Bostik Launches New Packaging Adhesive Range

Bostik, the adhesive solutions division of the Arkema Group, announces the launch of its new Kizen LIME range of packaging adhesives, a significant advancement in Arkema’s net zero emissions trajectory. The launch marks an important step in Bostik’s commitment to reducing its carbon footprint and improving the sustainability of its packaging solutions.

A unique and successful value chain collaboration between Bostik, Dow and Nordson has resulted in a new adhesive solution for end-of-line packaging that helps reduce pressure on fossil resources. It is designed for recyclable paper/paperboard packaging for fast-moving consumer goods.

Bostik is very pleased to announce the launch of Kizen LIME, an innovative proprietary formulation made with at least 80% renewable content, combining EN 16640:2017 certified bio-based materials and ISCC PLUS certified bio-circular materials. Kizen LIME also excels in adhesion and energy savings.

Dow’s AFFINITY RE helps Kizen™ LIME achieve nearly 100% carbon footprint avoidance, including biogenic carbon sequestration, thanks to an attractive byproduct from the food industry.

Kizen packaging products are 100% solids hot melt adhesives that are free of solvents and water. They are designed to provide a tamper-evident seal by tearing through the fibers of the paperboard packaging. The seal allows consumers to verify that the package has not been opened since the brand owner’s factory closed.