 Home > Encyclopedia > 4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one]

4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one]

4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one] structure

CAS No:
66085-69-6
Formula:
C41H36N8O2
Chemical Name:
4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one]
Synonyms:
3H-Pyrazol-3-one,4,4′-[(phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-;3H-Pyrazol-3-one,4,4′-[(phenylmethylene)bis[(2-methyl-4,1-phenylene)azo]]bis[2,4-dihydro-5-methyl-2-phenyl-;4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one]

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4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one] Basic Attributes

Molecular Weight：

672.8 g/mol

Exact Mass：

672.78

EC Number：

266-130-7

Characteristics

PSA：

115 Å²

4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one] Use and Manufacturing

Manufacturing Info：

3H-Pyrazol-3-one, 4,4'-[(phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-: ACTIVE

Computed Properties

Molecular Weight:672.8
XLogP3:8.8
Hydrogen Bond Acceptor Count:8
Rotatable Bond Count:9
Exact Mass:672.29612242
Monoisotopic Mass:672.29612242
Topological Polar Surface Area:115
Heavy Atom Count:51
Complexity:1250
Undefined Atom Stereocenter Count:2
Covalently-Bonded Unit Count:1
Compound Is Canonicalized:Yes

Hot Searches: methyl chloride; propyne; sodium amytal; 1 butene; lead ii iodide; hexene

Guide of 4,4′-[(Phenylmethylene)bis[(2-methyl-4,1-phenylene)-2,1-diazenediyl]]bis[2,4-dihydro-5-methyl-2-phenyl-3H-pyrazol-3-one]

Basic Attributes
Characteristics
Use and Manufacturing
Computed Properties

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