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Home > News > Market Flash > Hempel launches first thermal barrier coating system Hempatherm IC

Hempel launches first thermal barrier coating system Hempatherm IC

ECHEMI 2024-03-22

As the need to control maintenance costs and manage Corrosion Under Insulation (CUI) increases, Hempel A/S introduces Hempatherm IC. The seamless coating system has one of the highest film-building capabilities on the market, significantly reducing the risk of water ingress and entrapment, providing superior protection and mitigation of CUI.

 

The system, consisting of Hempatherm IC 170 and Hempatherm IC 175, is designed to replace many conventional insulation systems in critical CUI temperature ranges. It both insulates and mitigates CUI, maximizing the life of industrial equipment and assets.

 

"Process industry operators are constantly looking for solutions to reduce the risk of CUI while responsibly managing personnel safety and energy consumption. They need robust solutions that minimize disruption and provide long-term value." said Zechariah Lim, product manager CUI/High Heat & Insulation at Hempel.

 

"The Hempatherm IC system meets this need and is designed with the customer's energy saving needs in mind, without the associated risk of CUI. Coatings offer a simple and elegant alternative to meet this requirement while improving cost competitiveness, productivity and sustainability over their lifetime for all stakeholders along the value chain. "

 

“Hempel is excited to participate in the market shift from mechanical insulation to advanced insulating coating systems,” said David Hunter, Hempel CUI/High Thermal and Insulation Division Development Manager. “The performance of thermal insulation coatings has been proven for over 25 years, but film thickness has so far limited their use as an alternative. Our Hempatherm system offers the highest number of layers per film on the market. One of the systems whose materials are engineered to maintain thermal performance over a 15-25 year service life."

 

Hempathem IC prevents water from entering and becoming trapped on insulating equipment, eliminating the risk of CUI. Airgel fillers have low thermal conductivity and can replace many types of traditional mechanical insulation materials over the critical CUI temperature range (-25°C to 177°C). The non-flammable formula is safe to use on hot surfaces for quick maintenance to ensure assets remain operational with minimal disruption to operations.

Disclaimer: ECHEMI reserves the right of final explanation and revision for all the information.

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