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Industrial Grade Dendritic Ag-Cu Powder

Name: Industrial Grade Dendritic Ag-Cu Powder
Brand: Entrepreneur
SKU: pr2310071281
Price: 1 USD
Availability: InStock

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CAS No.:

7440-50-8

Grade:

Industrial Grade

Content:

70%

Port:

Shanghai

Brand:

Entrepreneur

Packaging:

1kg /bag, 25kg/drum

Price valid (until):

2024-02-29

Contact Supplier

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Beijing Entrepreneur Science & Trading Co., Ltd.

Company Type:

Trader

Location:

China

Qualification:

Main Products:

Flavor & Fragrance Ingredients,Plasticizer,API,Pharmaceutical Intermediates,Thermal Powder,Plant Extract

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Product Description
Seller Information
Inquiry History

Description

Dendritic Silver-Coated Copper Powder or Dendritic Ag-Cu Powder, is a specialized type of powder that consists of copper particles coated with a layer of silver. The term "dendritic" refers to the unique branching or tree-like structure that the silver coating forms on the surface of the copper particles.

This powder combines the electrical conductivity of copper with the enhanced properties of silver, making it a versatile and valuable material in various applications. The silver coating provides additional benefits such as improved corrosion resistance, enhanced thermal conductivity, and excellent solderability.

Dendritic Silver-Coated Copper Powder is commonly used in the electronics industry for applications that require high electrical conductivity, such as conductive inks, pastes, and adhesives. It is also utilized in the production of electronic components, including printed circuit boards (PCBs), semiconductor devices, and connectors.

The unique dendritic structure of the silver coating ensures a large surface area, allowing for effective contact and improved performance in applications where conductivity and reliability are crucial. Additionally, the combination of copper and silver offers a cost-effective alternative to using pure silver while maintaining desirable electrical and thermal properties.

Overall, Dendritic Silver-Coated Copper Powder offers a balance of electrical conductivity, corrosion resistance, and cost-effectiveness, making it a preferred choice in various electronic and conductive applications.

Features

1. High Conductivity: Copper is known for its excellent electrical conductivity, and the dendritic structure of the powder further enhances its conductivity. The silver coating adds to the overall conductivity, making it suitable for applications that require efficient electrical pathways.

2. Enhanced Surface Area: The dendritic structure of the powder particles provides a large surface area, which is beneficial for improved adhesion and contact with other materials. This allows for better conductivity and enhanced performance in applications like conductive inks or coatings.

3. Electromagnetic Shielding: The combination of copper and silver in Dendritic Silver-Coated Copper Powder enables effective electromagnetic shielding properties. The dendritic structure and conductive properties make it suitable for applications where electromagnetic interference (EMI) shielding is required.

4. Antimicrobial Properties: The silver coating on the copper particles gives Dendritic Silver-Coated Copper Powder antimicrobial properties. It inhibits the growth of bacteria and other microorganisms, making it useful for applications where preventing microbial growth is desired, such as in antimicrobial coatings or medical devices.

5. Thermal Conductivity: Copper has excellent thermal conductivity, and the dendritic structure of the powder particles enhances heat transfer capabilities. This makes Dendritic Silver-Coated Copper Powder suitable for thermal management applications where efficient heat dissipation is essential.

6. Catalytic Potential: The unique structure and composition of Dendritic Silver-Coated Copper Powder make it potentially suitable as a catalyst in various chemical reactions. It can exhibit catalytic activity in processes such as electrochemical reactions or other catalytic applications.

7. Excellent oxidation resistance: Dendritic Silver-Coated Copper Powder generally exhibits good oxidation resistance due to the protective silver coating. The silver layer acts as a barrier between the copper core and the surrounding environment, helping to prevent direct oxidation of the copper particles.

Applications

1. Conductive Inks and Pastes

Dendritic Silver-Coated Copper Powder can be utilized in the formulation of conductive inks and pastes used in printed electronics, such as printed circuit boards (PCBs), RFID tags, and flexible electronics. It provides a large surface area, enabling better conductivity and adhesion to various substrates.

2. Electromagnetic Shielding

The combination of copper's conductivity and silver's enhanced performance makes Dendritic Silver-Coated Copper Powder suitable for electromagnetic shielding applications. It can be incorporated into coatings, paints, or composites to provide effective shielding against electromagnetic radiation.

3. Antimicrobial Coatings

Silver has antimicrobial properties, and when coated onto copper particles with a dendritic structure, it enhances the material's ability to inhibit the growth of bacteria and other microorganisms. Dendritic Silver-Coated Copper Powder can be incorporated into coatings for various surfaces, such as medical devices, touchscreens, door handles, and other high-touch surfaces to help prevent the spread of infections.

4. Thermal Interface Materials

The dendritic structure of the powder particles allows for improved contact and enhanced thermal conductivity. Dendritic Silver-Coated Copper Powder can be used in thermal interface materials to improve heat transfer between electronic components and heat sinks or other cooling devices.

5. Catalysis

The unique structure and composition of Dendritic Silver-Coated Copper Powder can make it potentially suitable as a catalyst in various chemical reactions, such as electrochemical processes, hydrogenation, or other catalytic reactions.

6. Conductive coating

Conductive coating, conductive adhesive, conductive lubricant and conductive rubber.

Specifications

Grade	Morphology	Silver content (wt %)	Particle size distribution (um)			Apparent density (g/cm³)	Tap density (g/cm³)	Moisture (%)	Total oxygen content (wt %)
Grade	Morphology	Silver content (wt %)	D10	D50	D90	Apparent density (g/cm³)	Tap density (g/cm³)	Moisture (%)	Total oxygen content (wt %)
EAC-1	Dendritic	5~30	≥1.4	6.0~8.0	≤20.0	0.6~1.0	1.6~1.8	≤0.2	≤0.30
D-CuAg-2	Dendritic	3~18%		35um

About Packaging

Storage

The product is sealed and packaged according to relevant specifications, and should be stored in a clean, dry place away from sunlight. If the product is not used for a long time after opening, or if it becomes damp due to other factors, it should be dried before use.

Package

1kg /bag, 25kg/drum or as your special request.

Certificates

Basic Info

Product Name:

Copper

Other Name:

Copper;C.I. 77400;C.I. Pigment Metal 2;1721 Gold;Raney copper;Arwood copper;Kafar copper;Copper Powder;CuEP;CuEPP;CE 1110;E 115 (metal);E 115;GE 1110;CE 115;Rame;TTAI;Copper element;TAI (metal);MF-DZ;TAI;CE 7 (metal);M 36.012;Nogac 18;CE 7;NDGAC 35;MD 1 (metal);MF-D2;MD 1;C 100 (metal);C 100;JTC 1OZ;HTE;3EC;DN 02;CE 25;CE 15;TSTO 35;200RL;CE 1100;3L Fire;FCC 115A;BSH (metal);BSH;22BB400;CS-F 150E;1100T;MF-D3;OFHC copper;OFHC;3EC-HTE;R 300 (metal);3EC-III;R 300;CF 78;SPC 4-8;BHY 13T;TUP;MA-CDS;3EC3;CE 8A;SQ-HTE;CuLox 6010;CuLox 6030;BHY 02B-T;SLP;Cu-At-W 250;BHN 02T;SRM394;SRM395;M 330;3EC-VLP;FCC 115;JTC;JTC-LP;JTC-AM;JTCS;SFR-Cu;GTS 35;GTS 35 (metal);CF-T 8;CU-FN 10;115A;Allbri Natural Copper;Silcoat FCC-SP 99;NDGC;YGP 35;TSC 35;SLP 18;DT GLMP;M 330 (metal);R 300A;SQ-VLP;CT 315E;CDX;CDX (metal);FCC-SP 99;Unicoat 2845;DP 3;DP 3 (metal);MFP-CU 125;BHY 22B-T;FX-BSH;100RXH;F 2WS;CU 112;2L3GT;BPF 18;NT-TAX-M;NT-TAX-O;GT;GT (metal);GT-MP;SFR-Cu 5;SFR-Cu 10;Cu-HWQ;MFP 1110;GTS 18;BHY 13HT;F 1WS;HCCD 101;XMCu;GTS 12;Micro Thin;GTS;GTS (element);GT-MP 35;CCL-HL 830;F 3B-WS;BHN;USLP 12;F 0WS;Double Thin F-NP;BAC 13B-NK120;3EC-VEP;FQ-VLP;B152-ETP;UCP 030;EFC 6000;SLP 105WB;CE 6;YB 10;Y 10 (metal);F 3WS18;Y 10;CE 6 (copper);F 2WS18;MC 2;MC 2 (metal);USLP-R 2;N 254Di;FGP;CF-T 9;MA-CD;TSTO;1300YM;XTF;F-CP;SLP 100;3EC-VLP35;BAC 13T;AM-FN;B-WS;3EC-VLP18;FCC 116;TQ-VLP;CF-T 9-18;CF-T 9B-THE;65555-90-0;72514-83-1;133353-46-5;133353-47-6;195161-80-9;1441640-38-5;1993435-25-8;2056901-56-3;2432029-48-4

CAS No.:

7440-50-8

Molecular Formula:

InChIKeys:

InChIKey=RYGMFSIKBFXOCR-UHFFFAOYSA-N

Molecular Weight:

63.54600

Exact Mass:

62.92960

EC Number:

231-159-6

UNII:

789U1901C5

ICSC Number:

0240

UN Number:

3089|3077

DSSTox ID:

DTXSID2023985

NCI Thesaurus Code:

C391

Color/Form:

Reddish, lustrous, ductile, malleable metal|Red metal; cubic

HScode:

7402000090

Categories:

Coating Materials

Characteristics

PSA:

XLogP3:

-0.00250

Appearance:

Reddish lustrous malleable odorless metallic solid.

Density:

8.94 g/cm³

Melting Point:

1083 °C

Boiling Point:

2595 °C

Flash Point:

-23ºC

Water Solubility:

Insoluble

Storage Conditions:

2-8ºC

Vapor Pressure:

0 mmHg (approx)

Toxicity:

LD50 intraperitoneal in mouse: 3500ug/kg

Flammability characteristics:

Noncombustible Solid in bulk form, but powdered form may ignite.

Odor:

Odorless /Copper dusts and mists/

Experimental Properties:

Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes|Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.|COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.|Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.|For more Other Experimental Properties (Complete) data for COPPER, ELEMENTAL (6 total), please visit the HSDB record page.

Air and Water Reactions:

Solid pieces are very slowly oxidized by air to give a green basic carbonate. Solid pieces become covered by a black oxide when heated in air. Insoluble in water.

Reactive Group:

Metals, Less Reactive

Reactivity Profile:

COPPER combines violently with chlorine trifluoride in the presence of carbon [Mellor 2, Supp. 1, 1956]. Is oxidized by sodium peroxide with incandescence [Mellor 2:490-93, 1946-1947]. Forms an unstable acetylide when acetylene is passed over samples that have been heated enough to form an oxide coating. Reacts more rapidly in powdered or granular form. Subject to explosive reaction then mixed in finely divided form with finely divided bromates chlorates and iodates of barium, calcium, magnesium, potassium, sodium, or zinc; these reactions are initiated by heat, percussion, and occasionally light friction [Mellor 2:310, 1946-1947]. A solution of sodium azide in copper pipe with lead joints formed copper azide and lead azide, both of these compounds can detonate [Klotz, 1973].

Flammable Limits:

Noncombustible Solid in bulk form, but powdered form may ignite.

Heat of Vaporization:

1150 cal/g

See More Copper Properties 

Hazard Identification

Classification of the substance or mixture

Not classified.

GHS label elements, including precautionary statements

Precautionary statement(s)
Pictogram(s)	No symbol.
Signal word	No signal word
Hazard statement(s)	none
Prevention	none
Response	none
Storage	none
Disposal	none

Other hazards which do not result in classification

no data available

Handling and Storage

Precautions for safe handling

NO open flames. Handling in a well ventilated place. Wear suitable protective clothing. Avoid contact with skin and eyes. Avoid formation of dust and aerosols. Use non-sparking tools. Prevent fire caused by electrostatic discharge steam.

Conditions for safe storage, including any incompatibilities

See Chemical Dangers.

See More Copper Safety Data Sheet 

Seller Information

Business Type:
Trader

Main Products:
Flavor & Fragrance Ingredients,Plasticizer,API,Pharmaceutical Intermediates,Thermal Powder,Plant Extract

Location:
Room 902, 917, Hua Teng Bei Tang Business Plaza, No.37 Nan Mo Fang Road, Chao Yang District, Bei Jing, China

Payment Terms:
L/C,100% TT in advance

Average lead Time:
5

Total Annual Revenue:
$5 million-$10 million

Total Employees:
11-50

Year of Establishment:
2001

Beijing Entrepreneur Science & Trading Co., Ltd. was established in the year 2001. We are focused on import and export business of high quality specialty chemicals. Since its establishment, relying on diligent efforts, spirit of enterprising and professional services, the company has established extensive cooperation with world-famous chemical manufacturers and gained a good reputation in China chemical industry.
We have stable distribution cooperation with world leading suppliers from America, Europe, Japan and Taiwan. We are distributors of Ames Advantage Material, Novamet, Lanxess, Momentive, Potters, Rhodia, Roquette, Oerlikon Metco, Inovyn, KJ Chemical, Tokuyama, Mitsubishi Chemical, Chang Chun Group, etc.
Our products selling in China include Conductive Powder, Thermal Conductive Powder, Microwave Absorbing Powder, Acrylamide Functional Monomer and Special UV Monomer, Special Epoxy Resin, Mercaptan Curing Agent, Silane, Fumed Silica and Precipitated Silica, PVC Paste Resin, PVA, Carbon Black, Modified Starch, Photocatalyst, Formaldehyde Capture agent, Root Blocking Agent, Platinum Catalyst, Vinyl Silicone Oil, Surfactant, etc
In 2014, the company entered the chemical export business. Based on our understanding of China chemical market, we select most qualified suppliers. We are able to source raw materials directly from factories. Most of our partners are the largest factory in China with over 20 years history. They have huge annual outputs, and hold ISO9001, ISO14001, GMP, KOSHER, HALAL, FDA, GSP, etc. certificates.
Our export products include Conductive Powder, Thermal Conductive Powder, Plant Extract, Inorganic Powder, Plasticizer, PVC Paste Resin, Silane, Flavors and Fragrances, Salen Catalysts and Ligands, Organic Intermediates, Pharmaceutical Intermediates.
We continue to add new product lines and chemical distribution centers to service a wider range of industries.
We hope to become a bridge between China chemical manufacturers and world-wide customers, continue to provide professional products and solutions for customers overseas. We look forward to considerable development in export business of specialty chemicals.
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Inquiry History

17 Inquiries

Country	Product	Purchase Quantity	Date Posted
China	copper	500 MT	Apr 14, 2026
India	Copper	1 KG	Feb 10, 2026
India	Copper	1 KG	Jan 28, 2026
Kenya	copper cathodes	3500 MT	Jan 7, 2026
India	Copper	25 MT	Jun 30, 2025
China	Copper	500 MT	Jan 25, 2024
India	Cu metal	5.00 MT	Aug 9, 2023
Finland	Copper	1000 KG	Oct 15, 2024
India	Copper	5000.00 KG	Feb 7, 2024
Pakistan	Copper	10.00 KG	Dec 15, 2023
Indonesia	copper powder	1 20' Fcl	Aug 2, 2023
Sweden	Copper Powder	1 MT	Mar 11, 2026
India	copper cathode	250 MT	Feb 10, 2026
India	copper cathode	250 MT	Jan 28, 2026
India	COPPER CATHODE NON LME 99.99% GRADE A	150 MT	Dec 10, 2025
Philippines	Copper	1 KG	Jul 14, 2023
India	Cerium	25.00 G	Feb 18, 2025

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Industrial Grade Dendritic Ag-Cu Powder

Product Description

Seller Information

Inquiry History

Classification of the substance or mixture

GHS label elements, including precautionary statements

Other hazards which do not result in classification

Precautions for safe handling

Conditions for safe storage, including any incompatibilities

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