Wanhua Chemical Applies for a Silicone Polymer Patent

On December 7, 2023, according to an announcement from the State Intellectual Property Office of China, Wanhua Chemical Group Co., Ltd. applied for a project called "a silicone polymer, preparation method and application in release agent."

Publication number CN117164861A, application date is September 2023.

The patent abstract shows that the present invention discloses a silicone polymer, a preparation method and its application in a release agent. The preparation method of the silicone polymer includes the following steps:

1) Add tetravinyltetramethylcyclotetrasiloxane dropwise into tetramethylcyclotetrasiloxane, and a hydrosilylation reaction occurs under the action of catalysis to obtain an organic silicon intermediate;

2) Add the organic silicon intermediate dropwise to the vinyl-terminated polyorganosiloxane, and a hydrosilylation reaction will occur under the action of catalysis to obtain an organic silicon polymer.

The release agent prepared according to the silicone polymer in the present invention has the characteristics of good curing performance, good sliding property, stable aging release force, high residual adhesion rate, good anti-fogging property and excellent anti-sticking property.

As a chemical giant, Wanhua Chemical’s current silicone-related products mainly include the following series.

WANICONE® Potting Adhesive Series

Suitable for potting of heat-generating electronic components, such as power modules, converters, inverters, sensors, electronic control units, etc.

Curing at room temperature or rapid curing by heating, maintaining elasticity at -50℃~200℃.

Excellent electrical properties protect electronic components from moisture and pollution from the outside.

WANICONE® Thermal Management Materials

Including thermally conductive silicone grease, thermally conductive adhesive and thermally conductive gel, suitable for assembly and reinforcement of power modules, bonding of electronic components, assembly of lamps, assembly of automobile parts, etc.

It can improve the heat dissipation effect between the heating device and the heat dissipation device.

It has good thermal conductivity and excellent interface contact, which can ensure smooth heat conduction and extend the life of electronic components.

WANICONE® Adhesive Series

It has fast curing speed, excellent electrical insulation, and is non-corrosive to any metal substrate. The silicone elastomer formed after curing has very strong adhesion to most substrates.

WANICONE® coating glue series

One-component dealcoholized room temperature curing silicone rubber, low viscosity, solvent-free, can quickly flow/fill/self-level after coating. It is widely used in the electronic assembly industry and is the best choice for precision electronic component interfaces and circuit board protection silicone rubber.