99% Purity Cu 7440-50-8 Copper Powder with good price

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• • Copper powder is a metal powder composed of copper element, with molecular formula Cu, molecular weight 63.55, CAS number 7440-50-8. Its appearance is light rose red or with metallic luster, melting point 1083℃, boiling point 2595℃

    Appearance and properties: Metal with red luster
    Melting point (℃): 1083
    Boiling point (℃): 2595
    Relative density (water = 1): 8.92
    Ignition temperature (℃): 700 (powder cloud)
    Solubility: Insoluble in water.
    Resistivity: 1.7×10-8 Ω·m2/m (20℃)

    Main Applications: Widely used in powder metallurgy, electrocarbon products, electronic materials, metal coatings, chemical catalysts, filters, heat pipes and other electromechanical parts and electronic aviation fields.
    

    Copper powder is known for its high electrical and thermal conductivity, making it an excellent choice for electrical and electronic applications. It is used in the production of conductive inks, pastes, and coatings for printed circuit boards (PCBs), electrical contacts, and electromagnetic shielding. The powder's ability to efficiently conduct heat also makes it suitable for heat sinks and thermal management systems.
    
    In addition to its electrical and thermal properties, copper powder exhibits good corrosion resistance. This makes it an ideal material for protective coatings, corrosion-resistant paints, and anti-fouling applications. It is often used in marine environments, plumbing systems, and architectural applications.
    
    Copper powder is also valued for its antimicrobial properties. It possesses inherent biocidal activity and is utilized in healthcare products, textiles, and surface coatings to prevent the growth of bacteria and fungi. This makes it suitable for medical devices, wound dressings, and hygienic applications.
    
    Furthermore, copper powder serves as a crucial ingredient in the production of metal alloys and sintered components. It is commonly used in the manufacturing of bronze, brass, and other copper-based alloys, imparting desirable mechanical properties such as strength, hardness, and wear resistance.

• Grade	Morphology	Particle size distribution (μm)			Bulk density   (g/cm3)	Tapped density   (g/cm3)	Moisture   (%)	Specific surface area (m2/g)
  		D10	D50	D90
  ATPN-C-1	Spherical	≥ 0.5	1.5~2.5	≤3.5	2.0~2.4	3.8~4.3	≤ 0.2	0.8~0.9
  ATPN-C-1A	Spherical	≥2.0	3.8~4.2	≤7.0	3.0~3.5	4.5~4.8	≤ 0.2	0.3~0.4
  ATPN-C-1A (Spheroidized)	Spherical	≥2.0	3.8~4.2	≤7.0	3.0~3.5	4.5~4.8	≤0.2	0.3~0.4
  ATPN-C-2	Spherical	≥2.5	5.0~6.0	≤10.0	3.0~3.5	4.5~4.8	≤ 0.2	0.25~0.3
  ATPN-C-2 (Spheroidized)	Spherical	≥2.5	5.0~6.0	≤10.0	3.0~3.5	4.5~4.8	≤0.2	0.25~0.3
  ATPN-PC-1	Flake	≥2.0	3.0~4.0	≤7.0	2.0~2.5	4.2~4.6	≤0.2	0.4~0.5
  ATPN-PC-2	Flake	≥4.0	6.5~7.5	≤12	2.4~2.7	4.5~5.0	≤0.2	0.35~0.4

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