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Home > News > Paint & Coating News > LG Chem and HL Mando to Develop Adhesives for Electronic Components

LG Chem and HL Mando to Develop Adhesives for Electronic Components

ECHEMI 2025-02-26

LG Chem announced that it will cooperate with HL Mando, a leading Korean automotive parts manufacturer, to jointly develop adhesives for automotive electronic parts. The move aims to expand LG Chem's share in the automotive adhesive market.

 

HL Mando is a leading global software-defined vehicle (SDV) company under the HL Group, dedicated to developing core components for autonomous driving solutions and vehicle safety. The company also leads the standardization of electronic components and materials in the automotive field of the HL Group.

 

LG Chem will conduct joint project development and application testing with HL Mando on thermally conductive gap filling materials for advanced driver assistance system (ADAS) control parts such as cameras and radars, and insulating adhesives for vehicle steering and braking systems. In particular, LG Chem will expand the scope of cooperation to include thermally conductive and adhesive materials for next-generation electronic parts.

 

In general, thermally conductive gap fillers for ADAS control parts are characterized by high thermal conductivity and are subject to various rigorous tests because they require high reliability. LG Chem has technology to enhance the thermal conductivity and stability of existing thermally conductive gap fillers to improve reliability. LG Chem aims to start mass production of thermally conductive gap fillers in 2026.

 

"We are committed to developing customized solutions and environmentally friendly adhesive technologies for products ranging from automotive bodies to various electronic components," said Kim Dong-choon, president of LG Chem Advanced Materials. "We will provide innovative and reliable adhesive solutions through our collaboration with HL Mando."

Disclaimer: ECHEMI reserves the right of final explanation and revision for all the information.

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