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Home > News > Company Dynamic > DuPont and Zhen Ding Technology join hands to promote the development of high-end printed circuit board technology

DuPont and Zhen Ding Technology join hands to promote the development of high-end printed circuit board technology

ECHEMI 2024-11-04

DuPont and Zhen Ding Technology Group announced that the two parties have reached a strategic cooperation agreement in the field of advanced printed circuit board (PCB) technology.

 

The signing ceremony was held at Shenzhen Pengrui Times Center. Charles Shen, Chairman of Ding Zhen, Yi Zhang, President of DuPont Asia Pacific, and Thean Ming Tan, Global Business Director of DuPont Copper Clad Laminate, attended the signing ceremony.

 

Through this strategic cooperation, DuPont and Zhen Ding will jointly work to enhance terminal applications, promote cutting-edge research and development, enhance material performance, promote the sustainable development of the electronics industry, and further deepen cooperation in the fields of intelligent manufacturing, corporate governance and sustainable development.

 

Yi Zhang, President of DuPont Asia Pacific, said: "As a leader in the global PCB industry, Dingzhen has rich technical expertise and is willing to cooperate to promote the development of the industry. DuPont is honored to work with top companies in the industry to enhance customer service levels and bring new innovative possibilities to the global electronics industry."

 

Charles Shen, Chairman of Zhending Group, said: "As a leader in the global electronic materials industry, DuPont has strong R&D capabilities, reliable quality, manufacturing capabilities and a stable global supply chain, which are core competitiveness that Zhending values very much. In this cooperation, both parties will integrate their respective resources to jointly explore growth opportunities and have a positive impact on the industry. Through comprehensive cooperation in the development of new materials and key technologies, we aim to meet the industry's demand for complex performance of advanced PCBs and promote future innovation."

Disclaimer: ECHEMI reserves the right of final explanation and revision for all the information.

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