Toray develops hybrid bonding insulating resin

Toray Industries announced the development of an insulating resin material for hybrid bonding (micro-joining).

The material is based on Semicofine and Photoneece, which are highly heat-resistant polyimide coatings used in semiconductor and display devices. The new material combines traditional polyimide coating agents with the company's processing and bonding technologies.

It can improve the yield and reliability of semiconductor devices in hybrid bonding processes, which require bonding semiconductor chips to metal electrodes. Toray will advance prototype design and provide samples to customers. The goal is to obtain material certification in 2025 and start mass production in 2028.

Among hybrid bonding, chip-to-wafer technology has attracted considerable attention for high-density packaging of different types of chips. The technology involves processing one wafer substrate to chip size and bonding it to another wafer substrate. Silica and other inorganic materials are often used as insulating materials in hybrid bonding.